| 鑽孔 |
材質：玻璃
產業：半導體封裝產業/矽光子產業
說明：TGV (through glass via)
□ Precise & accuracy < 1microns
□ Fast > 6000 holes/sec
□ Stability
半導體封裝產業/矽光子產業
玻璃 TGV (through glass via)
半導體封裝產業/矽光子產業
玻璃 TGV (through glass via)
半導體封裝產業/矽光子產業
玻璃 TGV (through glass via)
半導體封裝產業/矽光子產業
玻璃 TGV (through glass via)
